We gave you $14 quick bucks in a VEEV scoop. $202---$216 I do not see this getting past $222. If you have not sold I would./
These guys are off cycle.- Smartsheet Inc. Class A Common Stock is estimated to report earnings on03/12/2024. The upcoming earnings date is derived from an algorithm based on a company's historical reporting dates.
FORMFACTOR UPDATE- This was one of my deeper dives and to be honest I have yet to hear any commentary that echoes my thinking... ok. That's not good./ But lets just look at price action as that is usually the tell of the market. So we missed top and bottom line I think.. I was afraid to look the stock up for fear of being down pretty good. And I just crossed myself and looked. FORM FormFactor, Inc. B/O $42.95 +3.99(+10.24%)4:00 PM 02/09/24
Folks when we deployed $80,000 into the market a few weeks ago we timed it perfectly. Right in the middle of Jimbo's correction call! But the greater point we hit on every purchase! We are well up on everything!!!! Now we have to start being careful as our correction time period comes into view....
A) With the development of new process technologies and advanced packaging solutions, transistor scale and packaging density continue to grow. Today’s AI chips all use 2.5D stacking, 3D stacking, and Chiplet technology. These advancements lead to higher demand for chip test equipment, which also requires increasingly sophisticated test equipment to pinpoint errors. B)Since the only solution for chip manufacturers is to buy more tools to test chips, test equipment manufacturers have also greatly benefited from this round of AI hype. It is foreseeable that the global revenue of high-performance GPU chip testing equipment may exceed that of smartphone chip testing equipment in the next few years C)Advanced AI Requires Advanced IC Packaging Massive parallelism once existed exclusively in the realm of supercomputers, but recent advances in chip technology allow it to now reside on a single IC substrate that integrates literally billions of transistors. One key breakthrough in this area is the emergence of advanced packaging, which allows multiple logic functions to be positioned within very close proximity to each other to maximize speed and minimize energy consumption. Probing the Inner Limits Each layer must be functionally verified before going on the advanced package die stack stack, and may include up to 4000 test points called microbumps that lead to data paths, power supplies and ground. Microbump test points are positioned extremely close to each other, often within 45 μm. And each presents a very small probe target, on the order of 25 μm.
All the hooplah over AI has overshadowed a large story semi conductors always move in cycles and we have just moved off the bottom<----- ok lots of room to run. And testing is done for those semis as well as AI. This is going to be a boon for testing. I could add a " T " to our word for Testing but i think this falls under AI. Might we look at TER? Maybe.
I'M WAITING ON THE PAPERWORK BUT THIS MAY OF BEEN MASSIVE-- $90 PRINT IN THE PRE... STONEY SHORT CALL (WELL HF TO BE HONEST) DID THEY DO IT IN THE PRE? I HOPE. RESULT: $65 YUP $90------------>$65 THAT MUST OF BEEN SOME CC.